A joint industry capability-building initiative by CREST and UTP CAPE

ENgineering Talent For Semiconductor

Build the skills to thrive in Malaysia’s fast-growing semiconductor industry.

Build the expertise shaping the future of semiconductors.

CREST × CAPE brings together three specialised professional programmes under the Engineering Talent for Semiconductor (ETSI) initiative, designed to help engineers and semiconductor professionals strengthen their understanding of advanced packaging technologies and their applications.

From 2.5D, 3D and chiplets to CoWoS for AI and HPC and advanced packaging reliability, each programme focuses on emerging technologies and practical knowledge relevant to the evolving semiconductor industry.

Choose the programme that matches your technical interests and professional goals.

WHO IS IT FOR?

Designed for engineers, technical professionals, semiconductor practitioners, R&D teams and professionals looking to deepen their expertise in advanced semiconductor technologies.

Three specialised programmes. Emerging technologies. Built for the semiconductor industry.
Write your awesome label here.

Interested? Let’s get you started.

Scan the QR code or click below to register your interest.

Featured links

Connect with us

Copyright © 2026