Stacking Innovation From 2D to 3D: Unlocking the Future of Semiconductor Packaging through 3D IC Integration

Ts Dr Norlin Nosbi serving as a lecturer and researcher at Mechanical Engineering Department, Universiti Teknologi PETRONAS (UTP). She is a materials engineering specialist with over a decade of academic, research, and industry experience aligned with advanced materials applications. She holds a B.Eng. (Hons.), a MSc and a PhD in Materials Engineering. Research focuses on advanced materials, nanomaterials, composite systems, and surface engineering, with applications in semiconductor packaging, reliability, and failure analysis.                        
Over the years, She have been involved in teaching, research, consultancy, and industry collaboration, particularly in materials processing and characterization, corrosion engineering, coatings, and semiconductor manufacturing. She have also worked with industry and training institutions, providing practical experience alongside academic research.