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ANSYS Mechanical Basics: Quick dive into electromigration simulation |
Advanced Packaging
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Electromigration
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Simulation approach
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This one hour course introduces the simulation of electromigration in semiconductor packaging using ANSYS Mechanical. Participants will learn the fundamentals of electromigration, including current density, Joule heating, temperature rise, and thermal stress. Through guided activities, participants will learn the simulation workflow, from geometry creation and material definition to meshing, physics setup, solver execution, and post-processing. The course concludes with interpreting simulation results to assess electromigration hotspots, and support design optimization.
Meet the instructor
Zainal Burhanudin
Ts Dr Zainal Arif Burhanudin serves as an Associate Professor at Universiti Teknologi PETRONAS, with over 17 years of research experience in semiconductor electronics and more than 3 years of industry exposure. He is holding a PhD in Nanotechnology, he brings a strong combination of academic excellence, practical industry insight, and hands-on research expertise that makes his training sessions highly relevant to professionals in semiconductor industry.
Patrick Jones - Course author
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