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Fundamentals of Electromigration in Semiconductor Advanced Packaging |
Advanced Packaging
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Electromigration
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Simulation approach
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This course provides an overview of electromigration in semiconductor advanced packaging, covering the role of advanced packaging in the semiconductor ecosystem, fundamental electromigration physics, failure mechanisms, and reliability considerations. Participants will also gain an introduction to simulation approaches for analyzing electromigration-related failures, providing essential knowledge for reliability-driven semiconductor package design and development.
Meet the instructor
Zainal Burhanudin
Ts Dr Zainal Arif Burhanudin serves as an Associate Professor at Universiti Teknologi PETRONAS, with over 17 years of research experience in semiconductor electronics and more than 3 years of industry exposure. He is holding a PhD in Nanotechnology, he brings a strong combination of academic excellence, practical industry insight, and hands-on research expertise that makes his training sessions highly relevant to professionals in semiconductor industry.
Patrick Jones - Course author
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