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Introduction to Failure Modes in Semiconductor Packaging
By the end of this session, you will be able to classify the most common semiconductor packaging failure modes (delamination, cracking, solder joint fatigue, TSV, Interconnect related failure), connect each mode to typical mechanisms and contributing process/material factors.
Format
NTW - Online
Course
Starting date
July 20
Open To:
Public
End Date
July 27
Duration
1 Hour
Price
Free
Learning Outcomes
Identify common semiconductor package failure modes and their typical signatures
Explain key failure mechanisms (mechanical, thermal, moisture, and electrical) in packaged devices
Recognize common root causes across assembly, materials, and operating conditions that drive package failures
Course Outline
Who Will Benefit Most
Identify if this programme aligns with your role, goals, and sustainability priorities
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