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Failure Analysis and Reliability Challenges in Advanced Semiconductor Packaging
Ts Dr Norlin Nosbi
This course introduces the fundamentals of failure analysis and reliability in advanced semiconductor packaging. Participants will explore common package failure mechanisms, understand how design, materials, and manufacturing processes influence reliability, learn key industry qualification tests, and apply systematic failure analysis techniques to identify the root causes of package failures.
What's included?
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4 Modules
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1 Certification
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10 Questions
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11 Video
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11 PDF
Become a Future Ready in Advanced Semiconductor Packaging
You will learn the essential concepts of reliability engineering, qualification testing, and failure analysis for advanced semiconductor packaging. From understanding failure mechanisms to applying industry-recognized investigation techniques and reliability standards, this course provides a strong foundation for solving packaging reliability challenges and supporting innovation in AI, high-performance computing, automotive, and consumer electronics. By the end of the course, you will be equipped to become future-ready in advanced semiconductor packaging.
Meet the instructor
Ts Dr Norlin Nosbi
Ts Dr Norlin Nosbi serving as a lecturer and researcher at Mechanical Engineering Department, Universiti Teknologi PETRONAS (UTP). She is a materials engineering specialist with over a decade of academic, research, and industry experience aligned with advanced materials applications. She holds a B.Eng. (Hons.), a MSc and a PhD in Materials Engineering. Research focuses on advanced materials, nanomaterials, composite systems, and surface engineering, with applications in semiconductor packaging, reliability, and failure analysis.
Over the years, She have been involved in teaching, research, consultancy, and industry collaboration, particularly in materials processing and characterization, corrosion engineering, coatings, and semiconductor manufacturing. She have also worked with industry and training institutions, providing practical experience alongside academic research.
Her expertise includes composite materials, nanomaterials, materials characterization, corrosion, and coating technologies, all of which are closely related to the reliability and performance of advanced semiconductor packages.
Patrick Jones - Course author
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